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SSM2375CBZ-REEL7 - Analog Devices

Description: Audio Amp Speaker 1-CH Mono 3.7W Class-D 9-Pin WLCSP EP T/R

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PCB Footprints
SSM2375CBZ-REEL7 - Analog Devices PCB footprint - BGA - BGA - 9-Ball Wafer Level Chip Scale Package [WLCSP] (CB-9-2)
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3D Models
SSM2375CBZ-REEL7 - Analog Devices  - 3D model - BGA - 9-Ball Wafer Level Chip Scale Package [WLCSP] (CB-9-2)
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SSM2375CBZ-REEL7 Details

  • Manufacturer Part Number:

    SSM2375CBZ-REEL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    WLCSP-9

  • Pin Count:

    9

  • Manufacturer Package Code:

    CB-9-2

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    12 dB

  • JESD-30 Code:

    S-PBGA-B9

  • JESD-609 Code:

    e3

  • Length:

    1.46 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3.2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.655 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.46 mm

SSM2375CBZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM2375CBZ-REEL7 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the power supply decoupling capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the output capacitor is properly sized and placed close to the device, and that the input and output traces are properly decoupled. Also, make sure to follow the recommended PCB layout guidelines and use a low-ESR output capacitor.
  • The SSM2375CBZ-REEL7 is rated for operation from -40°C to +125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. Consult the datasheet and thermal management guidelines for more information.
  • Yes, the SSM2375CBZ-REEL7 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is manufactured using a qualified process. However, additional testing and validation may be required for specific applications.
  • To troubleshoot issues, start by verifying the power supply voltage, input and output signals, and PCB layout. Check for proper decoupling, signal integrity, and thermal management. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.

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SSM2375CBZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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