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SSM3J327R,LF - Toshiba

Description: MOSFET Small-Signal MOSFET

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SSM3J327R,LF - Toshiba PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SSM3J327R,LF
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SSM3J327R,LF - Toshiba  - 3D model - SO Transistor Flat Lead - SSM3J327R,LF
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SSM3J327R,LF Details

  • Manufacturer Part Number:

    SSM3J327R,LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23F, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.95

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.9 A

  • Drain-source On Resistance-Max:

    0.093 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JESD-30 Code:

    R-PDSO-F3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM3J327R,LF Frequently Asked Questions (FAQs)

  • The recommended land pattern for SSM3J327R,LF is a rectangular pad with a size of 1.5mm x 0.8mm, with a 0.3mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations for SSM3J327R,LF, ensure good thermal conductivity between the component and the PCB by using a thermal via or a thermal pad. Also, consider using a thermal interface material (TIM) to improve heat transfer.
  • The maximum operating temperature range for SSM3J327R,LF is -40°C to 125°C. However, the device can be stored at temperatures between -40°C to 150°C.
  • To ensure the reliability of SSM3J327R,LF in high-reliability applications, follow proper handling and storage procedures, use a clean and dry environment, and avoid mechanical stress, electrical overstress, and thermal shock.
  • The SSM3J327R,LF has an ESD rating of 2kV human body model (HBM) and 150V machine model (MM). To prevent ESD damage, handle the component in an ESD-protected environment, use ESD-protective packaging, and follow proper handling procedures.

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SSM3J327R,LF Overview

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