Please enter a minimum 3 letters or numbers
Technical Content
Part Image

SSM3K15AFS,LF - Toshiba

Description: MOSFET SM Sig N-CH MOS 30V 0.1A 20V VGSS

Download SSM3K15AFS,LF Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
SSM3K15AFS,LF - Toshiba - PCB symbol
click to zoom
PCB Footprints
SSM3K15AFS,LF - Toshiba PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SSM3K15AFS,LF-1
click to zoom
3D Models
SSM3K15AFS,LF - Toshiba - 3D model - SOT23 (3-Pin) - SSM3K15AFS,LF-1
click to zoom

SSM3K15AFS,LF Details

  • Manufacturer Part Number:

    SSM3K15AFS,LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.1 A

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6.5 pF

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    0.1 W

  • Power Dissipation-Max (Abs):

    0.1 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM3K15AFS,LF Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the top and bottom layers connected to the thermal pad of the SSM3K15AFS,LF. This helps to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the pads and use a reflow oven or a hot air gun to solder the device. Avoid overheating the device.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device.
  • To handle ESD protection, use an ESD wrist strap or mat when handling the device. Ensure that the device is stored in an anti-static bag or tube. Use an ESD-protected workstation and follow proper ESD handling procedures.
  • The recommended operating temperature range for the SSM3K15AFS,LF is -40°C to 125°C. Operating the device outside this range may affect its performance and reliability.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SSM3K15AFS,LF Overview

Use the download button to access the SSM3K15AFS,LF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SSM3K, or try a keyword search, such as Small Signal Field-Effect Transistors

Suggested Parts

If you searched for SSM3K15AFS,LF, you might also be interested in these parts:
Part Number
SSM3K15AMFV,L3F
MRA4003T3G
VEMD8080
SFH7013
CT DBLP31.12-6C5D-56-J6U6-20-R18
2SA1586-GR,LF(T
2SC4117-GR,LF(T
DTA143ZU3HZGT106
C0805C519_8GAC

Parts related to SSM3K15AFS,LF

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑