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SSM3K56FS,LF(T - Toshiba

Description: SSM3K56FS,LF(T N-Channel MOSFET, 800 mA, 20 V, 3-Pin 2-2H1S Toshiba

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PCB Footprints
SSM3K56FS,LF(T - Toshiba PCB footprint - Other - Other - SSM SC-75, SOT-416
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3D Models
SSM3K56FS,LF(T - Toshiba  - 3D model - Other - SSM SC-75, SOT-416
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SSM3K56FS,LF(T Details

  • Manufacturer Part Number:

    SSM3K56FS,LF(T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.8 A

  • Drain-source On Resistance-Max:

    0.235 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6 pF

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM3K56FS,LF(T Frequently Asked Questions (FAQs)

  • The recommended operating temperature range is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • Follow the recommended soldering and mounting guidelines provided in the datasheet and Toshiba's application notes. Ensure the PCB is designed with adequate thermal dissipation, and the device is properly aligned and secured to prevent mechanical stress.
  • Handle the device in an ESD-controlled environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the device's pins or exposed internal components. Use anti-static packaging and follow proper storage and shipping procedures to prevent ESD damage.
  • While the SSM3K56FS,LF(T) is a high-quality device, it's essential to evaluate its suitability for high-reliability or safety-critical applications. Consult with Toshiba's application engineers and review the device's reliability and failure rate data to ensure it meets your specific requirements.
  • Start by reviewing the datasheet and application notes, and then consult with Toshiba's technical support team. Perform thorough debugging and testing to isolate the issue, and consider using simulation tools or evaluation boards to reproduce the problem.

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SSM3K56FS,LF(T Overview

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