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SSM6L09FUTE85LF - Toshiba

Description: MOSFET N-Ch P-Ch Sg FET 0.4A -0.2A 30V -30V

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SSM6L09FUTE85LF - Toshiba PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6lead
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SSM6L09FUTE85LF Details

  • Manufacturer Part Number:

    SSM6L09FUTE85LF

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.4 A

  • Drain-source On Resistance-Max:

    1.7 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7 pF

  • JESD-30 Code:

    R-PDSO-G6

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.3 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM6L09FUTE85LF Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to achieve this.
  • Handle the device in an ESD-controlled environment, wear an ESD strap, and use ESD-safe tools and materials to prevent damage. Avoid touching the device pins or exposing it to static electricity.
  • Yes, the device is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • The optimal operating frequency depends on the specific application requirements. Consult the datasheet and application notes for guidance on selecting the optimal frequency. Simulation tools and SPICE models can also be used to optimize the design.

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