Please enter a minimum 3 letters or numbers
Technical Content
Part Image

SSM6N56FE,LM - Toshiba

Description: Mosfet Array 20V 800mA 150mW Surface Mount ES6

Download SSM6N56FE,LM Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
SSM6N56FE,LM - Toshiba - PCB symbol
click to zoom
PCB Footprints
SSM6N56FE,LM - Toshiba PCB footprint - Other - Other - SOT-563
click to zoom
3D Models
SSM6N56FE,LM - Toshiba - 3D model - Other - SOT-563
click to zoom

SSM6N56FE,LM Details

  • Manufacturer Part Number:

    SSM6N56FE,LM

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.9

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.8 A

  • Drain-source On Resistance-Max:

    0.235 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6 pF

  • JESD-30 Code:

    R-PDSO-F6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.25 W

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM6N56FE,LM Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for SSM6N56FE,LM is -40°C to 150°C.
  • To ensure reliability, it is recommended to derate the power dissipation of SSM6N56FE,LM according to the temperature derating curve provided in the datasheet, and to ensure proper thermal management, such as using a heat sink or thermal interface material.
  • The maximum allowable power dissipation for SSM6N56FE,LM is 2.5W at a case temperature of 25°C.
  • To protect SSM6N56FE,LM from ESD, it is recommended to handle the device with an anti-static wrist strap or mat, and to ensure that the device is stored in an anti-static package or bag.
  • The recommended soldering temperature profile for SSM6N56FE,LM is a peak temperature of 260°C for 10 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SSM6N56FE,LM Overview

Use the download button to access the SSM6N56FE,LM schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SSM6N, or try a keyword search, such as Small Signal Field-Effect Transistors

Parts related to SSM6N56FE,LM

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑