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ST207EBPR - STMicroelectronics

Description: ST207EBPR, Line Transceiver, EIA/TIA-232-E, RS-232, V.28 5-TX 3-RX 3-TRX, 5 V, 24-Pin SSOP

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ST207EBPR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SSOP24
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ST207EBPR - STMicroelectronics  - 3D model - Small Outline Packages - SSOP24
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ST207EBPR Details

  • Manufacturer Part Number:

    ST207EBPR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, SSOP-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Differential Output:

    NO

  • Driver Number of Bits:

    5

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-E; TIA-232-E; V.28

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    8.2 mm

  • Number of Functions:

    3

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP24,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    10000 ns

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    3000 ns

  • Width:

    5.3 mm

ST207EBPR Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5275, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • STMicroelectronics provides a secure boot and firmware update mechanism through its STM32Cube ecosystem, which includes tools and software libraries for secure firmware updates and secure boot mechanisms. Additionally, the ST207EBPR has a built-in secure boot mechanism that can be configured using the STM32CubeMX tool.
  • The ST207EBPR has a maximum junction temperature of 125°C, and thermal management is critical to ensure reliable operation. Engineers should consider using thermal pads, heat sinks, and thermal interfaces to dissipate heat, and ensure that the PCB design allows for adequate airflow and heat dissipation.
  • To optimize power consumption, engineers can use the ST207EBPR's low-power modes, such as sleep mode and standby mode, and configure the device to use the lowest possible clock frequency and voltage. Additionally, using the STM32CubeMX tool, engineers can optimize the power consumption of the device by selecting the most power-efficient peripherals and configuring the power management unit (PMU).
  • The ST207EBPR is designed to meet the electromagnetic compatibility (EMC) requirements of various standards, including IEC 61000-4-2 and IEC 61000-4-4. Engineers should ensure that the PCB design and layout meet the EMC requirements, and consider using shielding, filtering, and grounding techniques to minimize electromagnetic interference (EMI).

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ST207EBPR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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