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STA350BWTR - STMicroelectronics

Description: 2.1-channel high-efficiency digital audio system Sound Terminal®

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STA350BWTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO-36 EPD
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STA350BWTR - STMicroelectronics  - 3D model - Small Outline Packages - PowerSSO-36 EPD
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STA350BWTR Details

  • Manufacturer Part Number:

    STA350BWTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSO-36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Power-Nom:

    36 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.45 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

STA350BWTR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the STA350BWTR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation in high-humidity environments, it is recommended to apply a conformal coating to the PCB, and to use a moisture-resistant packaging material. Additionally, the device should be stored in a dry environment, and the PCB should be designed to minimize moisture ingress.
  • The recommended decoupling capacitors for the STA350BWTR are 100nF to 1uF ceramic capacitors, placed as close as possible to the device's power pins. The capacitors should be rated for the operating voltage of the device, and should have a low equivalent series resistance (ESR) to minimize power supply noise.
  • To troubleshoot issues with the STA350BWTR, start by checking the power supply voltage and ensuring that it is within the recommended range. Check for proper PCB layout and decoupling, and verify that the device is properly soldered. Use an oscilloscope to check for signal integrity and power supply noise. If issues persist, consult the datasheet and application notes for further guidance.
  • The STA350BWTR has a maximum junction temperature of 150°C. To ensure reliable operation, the device should be operated at a junction temperature below 125°C. A thermal design should be implemented to ensure that the device is operated within the recommended temperature range, taking into account the ambient temperature, power dissipation, and thermal resistance of the device and PCB.

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STA350BWTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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