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STB18N55M5 - STMicroelectronics

Description: N-Channel MOSFET, 13 A, 550 V, 3-Pin D2PAK STMicroelectronics STB18N55M5

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STB18N55M5 - STMicroelectronics PCB footprint - Other - Other - STB18N55M5-7
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STB18N55M5 Details

  • Manufacturer Part Number:

    STB18N55M5

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Package Description:

    D2PAK-3

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    200 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    550 V

  • Drain Current-Max (ID):

    13 A

  • Drain-source On Resistance-Max:

    0.24 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    90 W

  • Pulsed Drain Current-Max (IDM):

    52 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STB18N55M5 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the STB18N55M5 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. A safe operating area can be defined as the region where the device can operate without exceeding its maximum ratings. For the STB18N55M5, this region is typically defined by the voltage and current limits, as well as the thermal constraints.
  • To ensure the STB18N55M5 is properly biased for optimal performance, follow the recommended biasing conditions outlined in the datasheet. This typically includes setting the gate-source voltage (Vgs) within the recommended range, ensuring the drain-source voltage (Vds) is within the specified limits, and providing a suitable gate drive circuit to minimize switching losses.
  • The recommended PCB layout and thermal management for the STB18N55M5 involve following best practices for power MOSFET design. This includes using a multi-layer PCB with a solid ground plane, placing the device close to the heat sink, and ensuring good thermal conductivity between the device and the heat sink. Additionally, consider using thermal vias and a thermal interface material to improve heat dissipation.
  • To protect the STB18N55M5 from electrostatic discharge (ESD), follow proper handling and storage procedures. This includes using anti-static wrist straps, mats, and bags, as well as ensuring that the device is stored in a static-protective environment. Additionally, consider adding ESD protection circuits, such as TVS diodes or ESD protection arrays, to the PCB design.
  • The reliability and lifetime expectations of the STB18N55M5 are dependent on various factors, including operating conditions, environmental factors, and manufacturing quality. According to the datasheet, the device is designed to meet specific reliability standards, such as AEC-Q101. However, the actual lifetime of the device may vary depending on the specific application and operating conditions.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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