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STB18N60M6 - STMicroelectronics

Description: MOSFET N-channel 600 V, 105 mOhm typ., 22 A MDmesh M6 Power MOSFET in a D2PAK package

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PCB Footprints
STB18N60M6 - STMicroelectronics PCB footprint - Other - Other - ST D²PAK (TO-263)
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3D Models
STB18N60M6 - STMicroelectronics  - 3D model - Other - ST D²PAK (TO-263)
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STB18N60M6 Details

  • Manufacturer Part Number:

    STB18N60M6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STB18N60M6 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the STB18N60M6 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general rule, it's recommended to operate the device within the specified maximum ratings and avoid operating conditions that may cause excessive heat, voltage, or current stress.
  • To ensure proper cooling, consider the device's thermal resistance (RthJA) and maximum junction temperature (Tj). Use a heat sink or thermal interface material to reduce the thermal resistance between the device and the ambient environment. Also, ensure good airflow and avoid blocking the heat sink's airflow path. You can use thermal simulation tools or consult with a thermal expert to optimize the cooling design.
  • The recommended PCB layout and routing for the STB18N60M6 involves minimizing the loop area of the high-current paths, using wide traces for the drain and source connections, and keeping the gate drive signal path short and shielded. It's also important to ensure good decoupling and to follow the manufacturer's recommended layout guidelines for the specific package type (e.g., TO-220).
  • Yes, you can use multiple STB18N60M6 devices in parallel to increase the current handling capability, but it's essential to ensure that the devices are properly matched and that the gate drive signals are synchronized. You should also consider the increased thermal dissipation and ensure that the heat sink design can handle the combined heat output.
  • To protect the STB18N60M6 from ESD, follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and bags. In the circuit design, consider adding ESD protection devices, such as TVS diodes or ESD protection arrays, to the input and output pins. You can also use ESD-resistant components and follow good PCB design practices to minimize the risk of ESD damage.

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STB18N60M6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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