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STGIPN3H60 - STMicroelectronics

Description: STMicroelectronics STGIPN3H60, Smart Power Module, 3 Phase, 3 A max, 600 V, 26-Pin NDIP SLLIMM-nano IPM, 3 A, 600 V, 3-phase inverter bridge IGBT

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PCB Footprints
STGIPN3H60 - STMicroelectronics PCB footprint - Other - Other - STGIPN3H60-3
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3D Models
STGIPN3H60 - STMicroelectronics  - 3D model - Other - STGIPN3H60-3
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STGIPN3H60 Details

  • Manufacturer Part Number:

    STGIPN3H60

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    NDIP-26

  • Pin Count:

    26

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDIP-T26

  • JESD-609 Code:

    e3

  • Length:

    29.15 mm

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    4.4 mm

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.62 mm

STGIPN3H60 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the STGIPN3H60 is 60 Hz, as specified in the datasheet. However, it's recommended to derate the frequency based on the application's specific requirements and environmental conditions.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended thermal management guidelines, such as using a heat sink, ensuring good airflow, and avoiding overheating. Additionally, consider using a thermistor or thermal sensor to monitor the device's temperature.
  • To minimize EMI, it's recommended to follow a good PCB layout practice, such as keeping the power traces short and away from sensitive analog signals, using a solid ground plane, and placing the device near the power source. Additionally, consider using shielding or a metal can to reduce radiated emissions.
  • To protect the device from overvoltage and overcurrent conditions, consider using a voltage regulator or a surge protector, and ensure that the device is operated within its recommended voltage and current ratings. Additionally, use a fuse or a current-limiting resistor to prevent damage from excessive current.
  • To prevent damage, it's recommended to store the STGIPN3H60 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the device by the body, avoiding touching the pins, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage.

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STGIPN3H60 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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