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STGIPS10K60A - STMicroelectronics

Description: STMicroelectronics STGIPS10K60A, SDIP Smart Power Module, 10 A max, 600 V, Through Hole

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STGIPS10K60A - STMicroelectronics PCB footprint - Other - Other - STGIPS10K60A
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STGIPS10K60A Details

  • Manufacturer Part Number:

    STGIPS10K60A

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    SDIP-25

  • Pin Count:

    25

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

STGIPS10K60A Frequently Asked Questions (FAQs)

  • The maximum junction temperature that the STGIPS10K60A can withstand is 150°C. However, it's recommended to keep the junction temperature below 125°C for reliable operation.
  • To ensure proper cooling, a heat sink with a thermal resistance of less than 1°C/W is recommended. Additionally, ensure good airflow around the device and avoid blocking the heat sink fins.
  • The recommended gate resistor value for the STGIPS10K60A is between 10 ohms and 100 ohms, depending on the specific application and switching frequency.
  • Yes, the STGIPS10K60A is suitable for high-reliability applications. It's manufactured using a robust process and has undergone rigorous testing to ensure its reliability.
  • To protect the STGIPS10K60A from overvoltage and overcurrent, use a voltage clamp or a transient voltage suppressor (TVS) to limit the voltage, and a current sense resistor or a fuse to detect and respond to overcurrent conditions.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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