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STGWA75H65DFB2 - STMicroelectronics

Description: Trench gate field-stop, 650 V, 75 A, high-speed HB2 series IGBT in a TO‑247 long leads package

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STGWA75H65DFB2 - STMicroelectronics - PCB symbol
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PCB Footprints
STGWA75H65DFB2 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 long leads-ren1
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STGWA75H65DFB2 - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-247 long leads-ren1
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STGWA75H65DFB2 Details

  • Manufacturer Part Number:

    STGWA75H65DFB2

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2020-04-03

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    115 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    7 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    357 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    210 ns

  • Turn-on Time-Nom (ton):

    44 ns

  • VCEsat-Max:

    2 V

STGWA75H65DFB2 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended for optimal thermal performance. The device should be placed near a heat sink or a metal plate to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or a thermal interface material to maintain a low junction temperature. Also, ensure that the device is not exposed to high humidity or moisture.
  • Handle the device by the body or the pins, avoiding any mechanical stress. Use an anti-static wrist strap or mat to prevent electrostatic discharge. Avoid touching the device's pins or die to prevent contamination or damage.
  • Use a logic analyzer or an oscilloscope to monitor the device's input and output signals. Check the device's power supply and ground connections. Verify that the device is operated within the recommended voltage and current ranges. Consult the datasheet and application notes for troubleshooting guidelines.
  • Use a metal shield or a Faraday cage to enclose the device and the PCB. Ensure that the PCB has a solid ground plane and that all cables and connectors are properly shielded. Use EMI filters or ferrite beads to reduce electromagnetic interference.

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STGWA75H65DFB2 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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