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STIPN2M50-H - STMicroelectronics

Description: SLLIMM-nano small low-loss intelligent molded module IPM, 3-phase inverter, 2 A, 1.7 Ohm max., 500 V MOSFET

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STIPN2M50-H - STMicroelectronics - PCB symbol
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PCB Footprints
STIPN2M50-H - STMicroelectronics PCB footprint - Other - Other - STIPN2M50-H-2
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STIPN2M50-H - STMicroelectronics - 3D model - Other - STIPN2M50-H-2
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STIPN2M50-H Details

  • Manufacturer Part Number:

    STIPN2M50-H

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

  • JESD-30 Code:

    R-XZMA-T26

  • Length:

    29.15 mm

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZMA

  • Package Equivalence Code:

    MODULE,26LEAD,1.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    4.4 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    ZIG-ZAG

  • Width:

    12.45 mm

STIPN2M50-H Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STIPN2M50-H is -40°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • To ensure proper cooling, it's recommended to use a heat sink with a thermal resistance of less than 10°C/W, and to maintain a maximum junction temperature of 150°C. Additionally, ensure good airflow and avoid blocking the heat sink's airflow path.
  • For optimal performance and thermal management, it's recommended to follow a 2-layer or 4-layer PCB layout with a solid ground plane, and to keep the power traces as short and wide as possible. Also, ensure the heat sink is properly connected to the PCB's ground plane.
  • Yes, the STIPN2M50-H is suitable for high-reliability and automotive applications due to its high temperature rating, low RDS(on), and high current capability. However, it's essential to follow the recommended operating conditions, and to perform thorough testing and validation to ensure the device meets the specific application requirements.
  • To protect the STIPN2M50-H from ESD, it's recommended to follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Additionally, ensure the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, and follow proper soldering and assembly techniques.

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STIPN2M50-H Overview

Use the download button to access the STIPN2M50-H schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STIPN, or try a keyword search, such as Motion Control Electronics

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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