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STIPN2M50T-HL - STMicroelectronics

Description: Power Driver Module MOSFET 3 Phase Inverter 500 V 2 A 26-PowerDIP Module (0.573", 14.50mm)

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STIPN2M50T-HL - STMicroelectronics - PCB symbol
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STIPN2M50T-HL - STMicroelectronics PCB footprint - Other - Other - STIPN2M50T-HL-3
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STIPN2M50T-HL - STMicroelectronics - 3D model - Other - STIPN2M50T-HL-3
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STIPN2M50T-HL Details

  • Manufacturer Part Number:

    STIPN2M50T-HL

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    NDIP-26

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-02-06

  • Manufacturer:

    STMicroelectronics

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XZMA-T26

  • Length:

    29.15 mm

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZMA

  • Package Equivalence Code:

    MODULE,26LEAD,1.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    4.4 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    ZIG-ZAG

  • Width:

    12.45 mm

STIPN2M50T-HL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STIPN2M50T-HL is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate within the -40°C to 125°C range for optimal performance and reliability.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet. Typically, this involves connecting the gate to a voltage source, and the drain to a load or a voltage source, while ensuring the correct voltage and current ratings are not exceeded.
  • For optimal thermal management, use a PCB with a thermal pad and a heat sink. Ensure good thermal conductivity by using a thermal interface material (TIM) between the device and the heat sink. Follow the recommended PCB layout guidelines in the datasheet, and consider using a thermal simulation tool to optimize the design.
  • To protect the STIPN2M50T-HL from ESD, follow proper handling and storage procedures. Use an ESD wrist strap or mat, and ensure all equipment and tools are properly grounded. Avoid touching the device's pins or exposed internal components, and use ESD-sensitive packaging and handling materials.
  • The recommended gate drive circuits and components for the STIPN2M50T-HL depend on the specific application and requirements. However, a typical gate drive circuit consists of a gate driver IC, a bootstrap diode, and a gate resistor. Consult the datasheet and application notes for specific recommendations and examples.

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STIPN2M50T-HL Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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