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STM1001SBWX6F - STMicroelectronics

Description: Reset circuit

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STM1001SBWX6F - STMicroelectronics PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - . SOT23-3 – 3-lead Small Outline
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STM1001SBWX6F - STMicroelectronics  - 3D model - SOT23 (3-Pin) - . SOT23-3 – 3-lead Small Outline
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STM1001SBWX6F Details

  • Manufacturer Part Number:

    STM1001SBWX6F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    ROHS COMPLIANT, SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.015 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    1.3 mm

STM1001SBWX6F Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern around the device can help to dissipate heat efficiently.
  • To ensure reliable communication in noisy environments, use a differential bus with a common-mode choke, and implement error detection and correction mechanisms such as CRC and checksum. Additionally, use a robust communication protocol like I2C or SPI, and consider using a noise filter or a shielded cable.
  • Handle the device by the body, not the pins, and avoid touching the pins to prevent electrostatic discharge (ESD) damage. Use an anti-static wrist strap or mat, and store the device in an anti-static bag or container. Avoid bending or flexing the pins, and use a soldering iron with a temperature-controlled tip to prevent overheating.
  • Use a logic analyzer or an oscilloscope to monitor the bus signals and verify that the device is receiving the correct commands and data. Check the power supply voltage and ensure it is within the recommended range. Verify that the device is properly configured and initialized, and check for any firmware or software issues.
  • For high-reliability applications, consider using a redundant system design, and implement error detection and correction mechanisms. Use a robust communication protocol, and ensure that the device is properly configured and initialized. Consider using a radiation-hardened or automotive-grade version of the device, and follow the recommended PCB layout and thermal management guidelines.

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STM1001SBWX6F Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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