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STM1061N23WX6F - STMicroelectronics

Description: Low power voltage detector

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STM1061N23WX6F - STMicroelectronics PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - . SOT23-3 – 3-lead Small Outline
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STM1061N23WX6F - STMicroelectronics  - 3D model - SOT23 (3-Pin) - . SOT23-3 – 3-lead Small Outline
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STM1061N23WX6F Details

  • Manufacturer Part Number:

    STM1061N23WX6F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    LEAD FREE, SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8.1

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.0036 mA

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    0.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.3 mm

STM1061N23WX6F Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded.
  • While the device is designed to operate in a wide range of temperatures, it is not recommended for use in high-humidity environments. If operation in high humidity is necessary, consider using a conformal coating or potting the device to protect it from moisture.
  • STMicroelectronics recommends soldering the device using a reflow soldering process with a peak temperature of 260°C for a maximum of 30 seconds. Hand soldering is not recommended.

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STM1061N23WX6F Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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