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STM6904PWEDS6F - STMicroelectronics

Description: Quad, ultralow voltage supervisor with push-button reset

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STM6904PWEDS6F - STMicroelectronics - PCB symbol
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STM6904PWEDS6F - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - MiniSO-8_2022-1
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STM6904PWEDS6F - STMicroelectronics - 3D model - Small Outline Packages - MiniSO-8_2022-1
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STM6904PWEDS6F Details

  • Manufacturer Part Number:

    STM6904PWEDS6F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3 X 3 MM, GREEN, TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.014 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

STM6904PWEDS6F Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout for the STM6904PWEDS6F in the application note AN4571, which includes guidelines for thermal pad connection, copper pour, and via placement to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device within its specified temperature range.
  • The STM6904PWEDS6F is not hermetically sealed, so it's essential to take precautions when operating in high-humidity environments. Consider using conformal coating, potting, or other environmental protection methods to prevent moisture ingress and ensure reliable operation.
  • The STM6904PWEDS6F is not specifically designed or tested for radiation hardness. If radiation hardness is required, consider using a different device or consulting with STMicroelectronics for custom solutions.
  • The STM6904PWEDS6F has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Additionally, consider using latch-up prevention techniques such as using a latch-up immune design, adding external protection devices, and following recommended PCB layout guidelines.

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STM6904PWEDS6F Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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