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STM6905TWEDS6F - STMicroelectronics

Description: Quintuple, ultralow voltage supervisor with push-button reset

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STM6905TWEDS6F - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - MiniSO-8(H=1.1mm)-2
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STM6905TWEDS6F - STMicroelectronics  - 3D model - Small Outline Packages - MiniSO-8(H=1.1mm)-2
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STM6905TWEDS6F Details

  • Manufacturer Part Number:

    STM6905TWEDS6F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.016 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.078,1.683V

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3 mm

STM6905TWEDS6F Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a stable temperature.
  • For EMI and EMC compliance, consider using a shielded enclosure, minimizing loop areas in the PCB layout, and using EMI filters or common-mode chokes to reduce emissions. Also, ensure that the device is properly decoupled and that the power supply is well-regulated.
  • To troubleshoot issues with the internal oscillator, check the oscillator circuitry for proper component values and PCB layout. Verify that the oscillator pins are not loaded excessively and that the power supply is stable. If issues persist, consider using an external oscillator or clock source.
  • Operating the device at the maximum junction temperature can reduce its lifespan and affect its reliability. It is essential to ensure that the device is operated within the recommended temperature range to maintain its performance and longevity.

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STM6905TWEDS6F Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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