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STPA008-48X - STMicroelectronics

Description: 4 x 50 W MOSFET quad bridge power amplifier Flexiwatt 27 (vertical) package

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Symbol
STPA008-48X - STMicroelectronics - PCB symbol
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PCB Footprints
STPA008-48X - STMicroelectronics PCB footprint - Other - Other - Flexiwatt 27
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3D Models
STPA008-48X - STMicroelectronics - 3D model - Other - Flexiwatt 27
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STPA008-48X Details

  • Manufacturer Part Number:

    STPA008-48X

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FLEXIWATT-27

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.01%

  • JESD-30 Code:

    R-XZFM-T27

  • JESD-609 Code:

    e3

  • Length:

    29.23 mm

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    27

  • Operating Temperature-Max:

    150 °C

  • Output Power-Nom:

    50 W

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZFM

  • Package Equivalence Code:

    ZIP27,.16,.16,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    19.37 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    ZIG-ZAG

  • Width:

    4.5 mm

STPA008-48X Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a large copper area connected to the tab of the device to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended derating curves for the device. Additionally, ensure that the device is properly mounted on a heat sink, and the PCB is designed to minimize thermal resistance. It is also recommended to use a thermal interface material (TIM) between the device and the heat sink.
  • The maximum safe operating area (SOA) for the STPA008-48X is not explicitly stated in the datasheet. However, it can be determined by consulting the device's characteristic curves and ensuring that the device operates within the recommended voltage and current limits. It is recommended to consult with STMicroelectronics' application engineers for specific guidance on SOA.
  • To protect the STPA008-48X from electrostatic discharge (ESD), it is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and ensuring that the device is stored in an ESD-safe environment. Additionally, the device should be handled in a controlled environment with humidity levels below 60%.
  • The recommended soldering profile for the STPA008-48X is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. It is essential to follow the recommended soldering profile to prevent damage to the device.

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STPA008-48X Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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