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STTH810FP - STMicroelectronics

Description: Ultrafast recovery - high voltage diode

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STTH810FP - STMicroelectronics - PCB symbol
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PCB Footprints
STTH810FP - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FPAC
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3D Models
STTH810FP - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220FPAC
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STTH810FP Details

  • Manufacturer Part Number:

    STTH810FP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AC

  • Package Description:

    PLASTIC, TO-220FPAC, 2 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.42

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, SNUBBER DIODE, HIGH RELIABILITY

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    60 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.085 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

STTH810FP Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STTH810FP is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal management guidelines, including proper heat sinking, thermal interface materials, and airflow. Additionally, consider derating the device's power dissipation at high temperatures.
  • For optimal thermal performance, use a PCB layout with a large copper area connected to the device's thermal pad, and ensure good thermal conductivity between the device and the heat sink. A 2-3 layer PCB with a solid copper ground plane is recommended.
  • To handle the high current capability, ensure your PCB design can handle the high current density, and use thick copper traces (at least 2 oz) with adequate spacing to prevent overheating. Also, consider using multiple vias to connect the device to the power plane.
  • To minimize EMI and RFI, use a shielded enclosure, keep the device away from sensitive circuits, and use a common-mode choke or ferrite bead to filter the input voltage. Additionally, ensure good PCB layout practices, such as separating analog and digital grounds.

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STTH810FP Overview

Use the download button to access the STTH810FP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STTH8, or try a keyword search, such as Rectifier Diodes

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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