SUD19P06-60-E3 footprint, schematic symbol and 3D model by Vishay

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PCB Footprints

SUD19P06-60-E3 - Vishay PCB footprint - Other - Other - DPAK (TO-252)_2025-1.4

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Datasheet Download Datasheet
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Part Number SUD19P06-60-E3
Manufacturer Vishay
Pin Count 3
Part Category MOSFET (P-Channel)
Package Category Other
Footprint Name Other - DPAK (TO-252)_2025-1.4
Released Date Jul 16, 2025
Last Modified Date Sep 11, 2025 1:03 PM UTC
Pinout / Pin List Click Here (Member Only)

SUD19P06-60-E3 Details

Manufacturer Part Number:
SUD19P06-60-E3
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
ROHS COMPLIANT PACKAGE-3
ECCN Code:
EAR99
Factory Lead Time:
8 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
5.4
Avalanche Energy Rating (Eas):
24.2 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
19 A
Drain-source On Resistance-Max:
0.12 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
P-CHANNEL
Power Dissipation-Max (Abs):
38.5 W
Pulsed Drain Current-Max (IDM):
30 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

SUD19P06-60-E3 Frequently Asked Questions (FAQs)

The recommended land pattern for SUD19P06-60-E3 is a rectangular pad with a size of 1.5 mm x 2.5 mm, with a solder mask clearance of 0.2 mm around the pad.
While SUD19P06-60-E3 is rated for operation up to 150°C, it's recommended to derate the power handling at high temperatures. Consult the datasheet for derating curves and consult with a thermal expert for specific application guidance.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pad. Avoid overheating the component, and use a soldering technique that minimizes thermal shock.
The maximum allowable voltage transient for SUD19P06-60-E3 is 1.5 times the rated voltage (60V) for a duration of 100 ms. Exceeding this limit may damage the component.
While SUD19P06-60-E3 is suitable for high-frequency applications, the component's parasitic inductance and capacitance may affect performance. Consult the datasheet for high-frequency characteristics and consider using a simulation tool to model the component's behavior.

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