- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SX1501I087TRT
- Part Number SX1501I087TRT
- Manufacturer SEMTECH
- Pin Count 21
- Part Category Integrated Circuit
- Package Category Quad Flat No-Lead
- Footprint Name Quad Flat No-Lead - QFN-UT 20-pin
- Released Date May 17, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SX1501I087TRT Details
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Manufacturer Part Number:
SX1501I087TRT
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Rohs Code:
Yes
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Part Life Cycle Code:
Active Unconfirmed
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Part Package Code:
QFN
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Package Description:
3 X 3 MM, 0.40 MM PITCH, QFN-20
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Pin Count:
20
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HTS Code:
8542.39.00.01
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Manufacturer:
Semtech Corporation
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YTEOL:
2
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JESD-30 Code:
S-PQCC-N20
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JESD-609 Code:
e3
SX1501I087TRT Frequently Asked Questions (FAQs)
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A good PCB layout for the SX1501I087TRT involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
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To ensure proper biasing, make sure to connect the VCC pin to a stable 1.8V power supply, and the GND pin to a solid ground plane. Also, ensure that the input voltage (VIN) is within the recommended range of 1.65V to 3.6V. Additionally, use a 10uF decoupling capacitor between VCC and GND to filter out noise.
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The SX1501I087TRT can operate up to 150MHz, but the maximum operating frequency depends on the specific application and the quality of the PCB layout. It's recommended to consult the datasheet and application notes for specific guidance on operating frequency.
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The SX1501I087TRT has built-in ESD protection, but it's still recommended to take precautions during handling and assembly. Use an ESD wrist strap or mat, and ensure that the device is stored in an anti-static bag or tube. Additionally, consider adding external ESD protection devices, such as TVS diodes, to the PCB design.
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The SX1501I087TRT has a maximum junction temperature of 150°C. To ensure proper thermal management, use a heat sink or thermal pad on the exposed pad of the QFN package, and ensure good airflow around the device. Additionally, consider using thermal vias in the PCB design to dissipate heat.
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SX1501I087TRT Overview
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