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SZESD7C3.3DT5G - onsemi

Description: Small Body Outline Dimensions: 0.047 x 0.047 (1.20 mm x 1.20 mm); Low Body Height: 0.020 (0.5 mm); Standoff Voltage: 3.3V, 5V; Low Leakage; Response Time is < 1 ns; IEC61000-4-2 Level 4 ESD Protection

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SZESD7C3.3DT5G Details

  • Manufacturer Part Number:

    SZESD7C3.3DT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-723-3

  • Package Description:

    SOT-723, 3 PIN

  • Manufacturer Package Code:

    631AA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.11

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    5 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.24 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD7C3.3DT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZESD7C3.3DT5G involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V power supply, and the GND pin to a solid ground plane. The input pins (VIN) should be biased to a voltage within the recommended operating range (0.8V to 2.5V). Additionally, ensure that the input signals are properly terminated to prevent ringing and reflections.
  • The SZESD7C3.3DT5G has an operating temperature range of -40°C to +125°C. However, it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance and reliability.
  • Yes, the SZESD7C3.3DT5G is designed to operate at high frequencies up to 5 GHz. However, it's essential to follow proper PCB layout and design guidelines to minimize signal loss and ensure optimal performance at high frequencies.
  • The SZESD7C3.3DT5G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-free environment.

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SZESD7C3.3DT5G Overview

Use the download button to access the SZESD7C3.3DT5G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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