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SZESD8351MUT5G - onsemi

Description: Low Capacitance (0.55 pF Max, I/O to GND); SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Low ESD Clamping Voltage; Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4) ISO 10605; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
SZESD8351MUT5G - onsemi PCB footprint - Other - Other - X3DFN2 0.62x0.32x0.24, 0.35P CASE 152AF ISSUE C_2023
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3D Models
SZESD8351MUT5G - onsemi  - 3D model - Other - X3DFN2 0.62x0.32x0.24, 0.35P CASE 152AF ISSUE C_2023
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SZESD8351MUT5G Details

  • Manufacturer Part Number:

    SZESD8351MUT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X3DFN-2

  • Manufacturer Package Code:

    152AF

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.79

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Max:

    7.8 V

  • Breakdown Voltage-Min:

    5.5 V

  • Breakdown Voltage-Nom:

    7 V

  • Clamping Voltage-Max:

    11.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD8351MUT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZESD8351MUT5G involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the VEE pin to a stable -5V power supply. The input common-mode voltage should be set to around 2.5V, and the output should be terminated with a 50Ω load to ground.
  • The SZESD8351MUT5G is rated for operation from -40°C to +125°C, but it's recommended to operate within the -20°C to +85°C range for optimal performance and reliability.
  • The SZESD8351MUT5G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and handle the device by the body or pins, not the leads.
  • The recommended input signal amplitude is 100mV to 1V peak-to-peak, and the frequency range is DC to 500MHz. However, the device can handle input frequencies up to 1GHz with reduced performance.

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SZESD8351MUT5G Overview

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Part Image ESD8351MUT5G onsemi

Trans Voltage Suppressor Diode, 3.3V V(RWM), Unidirectional, 1 Element, Silicon