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SZESD9B5.0ST5G - onsemi

Description: SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements ; AECQ101 Qualified and PPAP Capable ; This is a PbFree Device; Low Capacitance 15 pF; Low Clamping Voltage; Small Body Outline Dimensions: 0.039 x 0.024 (1.0mm x 0.60mm); Low Body Height: 0.016 (0.4 mm); Response Time is < 1 ns; IEC6100042 Level 4 ESD Protection; Low Leakage

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PCB Footprints
SZESD9B5.0ST5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-923 CASE 514AB-01 ISSUE C
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SZESD9B5.0ST5G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-923 CASE 514AB-01 ISSUE C
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SZESD9B5.0ST5G Details

  • Manufacturer Part Number:

    SZESD9B5.0ST5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923, 1.0x0.6, 0.40 Max Height

  • Package Description:

    SOD-923, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.44

  • Additional Feature:

    LOW CAPACITANCE, EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    7.8 V

  • Breakdown Voltage-Min:

    5.8 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD9B5.0ST5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZESD9B5.0ST5G involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Additionally, use a high-quality voltage regulator and decoupling capacitors to minimize noise and ensure a stable power supply.
  • The SZESD9B5.0ST5G has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as a thermal pad or heat sink, and ensure good airflow around the device.
  • Yes, the SZESD9B5.0ST5G is suitable for high-reliability and high-temperature applications. However, it's essential to follow the recommended operating conditions and derating guidelines specified in the datasheet to ensure reliable operation.
  • To troubleshoot issues with the SZESD9B5.0ST5G, start by verifying the power supply and input signals. Check for proper biasing, and ensure that the device is operated within the recommended specifications. Use oscilloscopes and other diagnostic tools to identify and isolate the issue.

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SZESD9B5.0ST5G Overview

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