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SZESD9X3.3ST5G - onsemi

Description: Low Leakage; Response Time is Typically < 1 ns; ESD Rating of Class 3 (> 16 kV) per Human Body Model; IEC6100042 Level 4 ESD Protection; These are PbFree Devices; Small Body Outline Dimensions: 0.039 x 0.024 (1.0 mm x 0.60 mm); Low Body Height: 0.017 (0.43 mm) Max; Standoff Voltage: 3.3 V 12 V

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Symbol
SZESD9X3.3ST5G - onsemi - PCB symbol
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PCB Footprints
SZESD9X3.3ST5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−923 CASE 514AB ISSUE D
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3D Models
SZESD9X3.3ST5G - onsemi - 3D model - Small Outline Diode Flat Lead - SOD−923 CASE 514AB ISSUE D
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SZESD9X3.3ST5G Details

  • Manufacturer Part Number:

    SZESD9X3.3ST5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923-2

  • Package Description:

    SOD-923, 2 PIN

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.46

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    5 V

  • Clamping Voltage-Max:

    10.4 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    102 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.15 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZESD9X3.3ST5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZESD9X3.3ST5G involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a common ground point for the input and output grounds.
  • To ensure proper biasing, connect the input pin to a stable voltage source, and ensure the output pin is connected to a load that meets the recommended operating conditions. Also, make sure the device is operated within the recommended temperature range.
  • The SZESD9X3.3ST5G has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as a thermal pad or heat sink, and ensure good airflow around the device.
  • Yes, the SZESD9X3.3ST5G is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure the device is properly qualified and validated for the specific application.
  • The SZESD9X3.3ST5G has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. Additionally, consider adding external ESD protection devices if the application requires it.

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SZESD9X3.3ST5G Overview

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