Description:Low Reverse Leakage Current (< 100 nA); IEC Compatibility: IEC 61000−4−2 (ESD): Level 4 IEC 61000−4−4 (EFT): 50 A (5/50 ns) IEC 61000−4−5 (Lighting) 3.5 A (8/20 µs); ISO 7637−1, Nonrepetitive EMI Surge Pulse 2, 8.0 A (1/50 µs); ISO 7637−3, Repetitive Electrical Fast Transient (EFT) EMI Surge Pulses, 50 A (5/50 ns); +175°C TJ(MAX) rating; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These are Pb−Free Devices; Flamm
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering.
Use an ESD wrist strap or mat, and ensure all equipment is grounded. Handle the device by the body or pins, avoiding direct contact with the die.
Store the device in its original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the device by the body or pins.
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SZNUP1128HT1G Overview
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