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SZNUP3105LT3G - onsemi

Description: 350 W Peak Power Dissipation per Line (8/20 µs Waveform); Low Reverse Leakage Current (< 100 nA); 30 pF Overall Capacitance with Diode Capacitance Matching; Flammability Rating UL 94 V−0; IEC Compatibility: − IEC 61000−4−2 (ESD): Level 4 − IEC 61000−4−4 (EFT): 50 A – 5/50 ns − IEC 61000−4−5 (Lightning) 8.0 A (8/20 µs); SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free an

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SZNUP3105LT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SZNUP3105LT3G
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SZNUP3105LT3G - onsemi  - 3D model - SOT23 (3-Pin) - SZNUP3105LT3G
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SZNUP3105LT3G Details

  • Manufacturer Part Number:

    SZNUP3105LT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    TO-236, 3 PIN

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.98

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    35.6 V

  • Clamping Voltage-Max:

    66 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    350 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-5

  • Rep Pk Reverse Voltage-Max:

    32 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    32 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZNUP3105LT3G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and adequate airflow. Monitor junction temperature (TJ) and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, 10uF to 22uF is recommended, while output capacitors should be 4.7uF to 10uF.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and ensure proper grounding and decoupling. Implement a common-mode choke or ferrite bead on the input lines if necessary.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.

Trust Checks

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