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T55F324I4 - Efinix

Description: Trion® Field Programmable Gate Array (FPGA) IC 130 2831360 54195 324-TFBGA

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T55F324I4 - Efinix PCB footprint - BGA - BGA - 324-Ball FBGA Package
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T55F324I4 - Efinix  - 3D model - BGA - 324-Ball FBGA Package
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T55F324I4 Details

  • Manufacturer Part Number:

    T55F324I4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    FBGA-324

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    EFINIX

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    130

  • Number of Logic Cells:

    54195

  • Number of Outputs:

    130

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    SMIC

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    12 mm

T55F324I4 Frequently Asked Questions (FAQs)

  • EFINIX provides a PCB design guide and layout recommendations in their application notes and design resources. It's essential to follow these guidelines to ensure optimal signal integrity, especially for high-speed interfaces like PCIe and DDR.
  • To optimize power consumption, use the EFINIX Power Analyzer tool to estimate power consumption based on your design's activity factors. Then, apply power-saving techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Implement a secure boot process using the EFINIX Secure Boot feature, which ensures that only authorized firmware can be loaded onto the device. Additionally, use encryption and secure key storage, and consider implementing a secure communication protocol like SSL/TLS.
  • Use the EFINIX ChipScope Pro tool for debugging and troubleshooting. This tool provides real-time visibility into the FPGA's internal signals, allowing you to identify and fix issues quickly. You can also use the built-in logic analyzer and signal tap features.
  • The T55F324I4 has a maximum junction temperature of 100°C. Ensure good airflow around the device, and consider using a heat sink or thermal interface material to dissipate heat. Monitor the device's temperature using the built-in thermal sensor and adjust your design accordingly.

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T55F324I4 Overview

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