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T8F81C2 - Efinix

Description: IC FPGA TRION T8 55 I/O 81FBGA

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PCB Footprints
T8F81C2 - Efinix PCB footprint - BGA - BGA - 81-Ball FBGA
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3D Models
T8F81C2 - Efinix  - 3D model - BGA - 81-Ball FBGA
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T8F81C2 Details

  • Manufacturer Part Number:

    T8F81C2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    FBGA-81

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    EFINIX

  • JESD-30 Code:

    S-PBGA-B81

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    55

  • Number of Logic Cells:

    7384

  • Number of Outputs:

    55

  • Number of Terminals:

    81

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA81,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    0.93 mm

  • Supply Voltage-Max:

    1.15 V

  • Supply Voltage-Min:

    1.05 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    SMIC

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    5 mm

T8F81C2 Frequently Asked Questions (FAQs)

  • EFINIX provides a PCB design guide and layout recommendations in their application notes and development kits. It's essential to follow these guidelines to ensure optimal signal integrity, especially for high-speed interfaces like PCIe and DDR3.
  • To optimize power consumption, use the EFINIX Power Analyzer tool to estimate power consumption based on your design's activity factors. Additionally, implement power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption.
  • Implement a secure boot mechanism, use encryption and authentication for bitstream storage, and utilize EFINIX's built-in security features like the Secure Boot and Authentication (SBA) module. Additionally, follow best practices for secure coding and IP protection.
  • Use EFINIX's ChipScope Pro tool for debugging and troubleshooting. It provides real-time visibility into the FPGA's internal signals, allowing you to identify and fix issues quickly. Additionally, implement debug modules and testbenches in your design to facilitate debugging.
  • The T8F81C2 has a maximum junction temperature of 100°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a well-designed PCB with adequate thermal vias. Monitor the FPGA's temperature using the built-in thermal sensor and adjust your design accordingly.

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T8F81C2 Overview

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