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TAS2552YFFR - Texas Instruments

Description: 4W Class-D Audio Power Amplifier with Speaker I-V Sense and Integrated Class-G Boost Converter

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TAS2552YFFR - Texas Instruments - PCB symbol
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TAS2552YFFR - Texas Instruments PCB footprint - BGA - BGA - DSBGA
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TAS2552YFFR - Texas Instruments - 3D model - BGA - DSBGA
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TAS2552YFFR Details

  • Manufacturer Part Number:

    TAS2552YFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    GAIN RANGE IS MINUS 7 DB TO PLUS 24 DB

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PBGA-B30

  • JESD-609 Code:

    e1

  • Length:

    2.855 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    94 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    4 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA30,5X6,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Supply Current-Max:

    30 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.575 mm

TAS2552YFFR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TAS2552YFFR involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. TI provides a recommended PCB layout in the datasheet and application notes.
  • To optimize the performance of the TAS2552YFFR in a noisy environment, use a low-pass filter on the input, add a shield around the device, and use a high-quality power supply with a low noise floor. Additionally, consider using a ferrite bead or a common-mode choke to filter out high-frequency noise.
  • The TAS2552YFFR can handle up to 10W of power, but this depends on the specific application and thermal design. It's essential to follow the thermal design guidelines in the datasheet to ensure reliable operation.
  • The TAS2552YFFR has several configuration options, including gain settings, filter settings, and clock settings. Refer to the datasheet and application notes for specific configuration guidelines for your audio application.
  • The TAS2552YFFR has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer. Follow the thermal design guidelines in the datasheet to ensure reliable operation.

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TAS2552YFFR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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