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TAS5012IPFB - Texas Instruments

Description: True Digital Audio Amplifier 48-Pin TQFP Tray

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TAS5012IPFB - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PFB (S-PQFP-G48) HEIGHT 1.2
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TAS5012IPFB - Texas Instruments  - 3D model - Quad Flat Packages - PFB (S-PQFP-G48) HEIGHT 1.2
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TAS5012IPFB Details

  • Manufacturer Part Number:

    TAS5012IPFB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    PLASTIC, TQFP-48

  • Pin Count:

    48

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP48,.35SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

TAS5012IPFB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TAS5012IPFB evaluation module documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To optimize the TAS5012IPFB for low power consumption, ensure that the device is operated at the lowest possible supply voltage, use the lowest possible clock frequency, and disable any unused features or peripherals. Additionally, consider using the device's power-saving modes, such as the low-power standby mode or the shutdown mode.
  • The maximum allowed voltage on the analog input pins of the TAS5012IPFB is the supply voltage (VCC) + 0.3V. Exceeding this voltage may damage the device. It is recommended to use voltage-limiting resistors or clamping diodes to protect the device from overvoltage conditions.
  • To troubleshoot issues with the TAS5012IPFB's I2S interface, check the clock frequency and phase, ensure that the correct data format is being used, and verify that the I2S pins are properly connected and terminated. Additionally, use a logic analyzer or oscilloscope to monitor the I2S signals and identify any errors or anomalies.
  • The thermal resistance of the TAS5012IPFB package is typically around 25°C/W for the junction-to-ambient thermal resistance (RθJA) and 10°C/W for the junction-to-case thermal resistance (RθJC). This information can be used to estimate the device's junction temperature and ensure that it remains within the recommended operating range.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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