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TAS5412TPHDRQ1 - Texas Instruments

Description: Two-Channel Automotive Digital Amplifier

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TAS5412TPHDRQ1 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PHD0064B
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TAS5412TPHDRQ1 - Texas Instruments  - 3D model - Quad Flat Packages - PHD0064B
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TAS5412TPHDRQ1 Details

  • Manufacturer Part Number:

    TAS5412TPHDRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    36 dB

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    25 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTQFP

  • Package Equivalence Code:

    TQFP64,.63SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    24 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

TAS5412TPHDRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TAS5412TPHDRQ1 evaluation module (EVM) user's guide, which can be found on the TI website. The EVM user's guide includes a detailed layout guide, including Gerber files and PCB design files.
  • To optimize thermal performance, ensure good thermal conductivity between the device and the PCB by using a thermal pad or thermal tape. Also, use a heat sink or a thermal interface material (TIM) to dissipate heat. Additionally, follow the recommended PCB layout and use a sufficient number of thermal vias to dissipate heat.
  • The maximum power dissipation of the TAS5412TPHDRQ1 is dependent on the operating conditions, such as ambient temperature, supply voltage, and output current. Refer to the datasheet for the thermal characteristics and power dissipation calculations. Typically, the maximum power dissipation is around 15W.
  • Use an overvoltage protection (OVP) circuit and an undervoltage lockout (UVLO) circuit to protect the device from voltage transients and faults. The OVP circuit can be implemented using a voltage supervisor IC, such as the TLV7031, and the UVLO circuit can be implemented using a voltage detector IC, such as the TLV7035.
  • The recommended input capacitor value for the TAS5412TPHDRQ1 is dependent on the input voltage and output current requirements. Typically, a 10uF to 22uF ceramic capacitor is recommended for most applications. However, it's essential to perform a thorough input capacitor selection and verification process to ensure stability and performance.

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TAS5412TPHDRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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