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TAS5414ATDKDMQ1 - Texas Instruments

Description: AUTOMOTIVE DIGITAL AMPLIFIERS

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TAS5414ATDKDMQ1 Details

  • Manufacturer Part Number:

    TAS5414ATDKDMQ1

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    GREEN, PLASTIC, HSSOP-36

  • Pin Count:

    36

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    32 dB

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e4

  • Length:

    15.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    116 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.56

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    3.6 mm

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

TAS5414ATDKDMQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the TAS5414ATDKDMQ1 evaluation module (EVM) user's guide, which can be found on the TI website. The EVM user's guide includes a detailed layout guide, including component placement, routing, and thermal management considerations.
  • To optimize thermal performance, ensure good airflow around the device, use a heat sink with a thermal interface material (TIM), and follow the recommended PCB layout guidelines. Additionally, consider using thermal vias and thermal pads to improve heat dissipation. TI also provides thermal simulation models and tools to help with thermal design.
  • The maximum power dissipation of the TAS5414ATDKDMQ1 is dependent on the operating conditions, such as supply voltage, output current, and ambient temperature. Refer to the datasheet for the power dissipation calculation formula and thermal resistance values. Typically, the maximum power dissipation is around 15W to 20W, but this can vary depending on the specific application.
  • TI provides a troubleshooting guide in the datasheet and application notes. Common issues include incorrect power sequencing, inadequate decoupling, and thermal-related problems. Use oscilloscopes and logic analyzers to debug the device, and consult the TI support forums and documentation for guidance.
  • TI provides a list of recommended components, including capacitors, resistors, and inductors, in the datasheet and application notes. These components are tested and validated to ensure optimal performance and reliability. It is recommended to use these components to ensure compatibility and minimize design risks.

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TAS5414ATDKDMQ1 Overview

Use the download button to access the TAS5414ATDKDMQ1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like TAS54, or try a keyword search, such as Audio/Video Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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