FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Supply Current-Max:
83 mA
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
3 V
Surface Mount:
YES
Temperature Grade:
OTHER
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
7 mm
TAS5709APHPR Frequently Asked Questions (FAQs)
The recommended power-up sequence is to apply PVDD (analog power) first, followed by DVDD (digital power), and then the clock signal. This ensures proper initialization of the device.
To optimize thermal performance, ensure good airflow around the device, use a heat sink if possible, and avoid blocking the thermal pads on the package. Additionally, minimize the power dissipation by optimizing the system design and reducing the current consumption.
The maximum allowed clock jitter for the TAS5709APHPR is 100 ppm. Exceeding this value may affect the device's performance and audio quality.
To configure the TAS5709APHPR for mono or stereo audio output, use the I2C interface to set the appropriate registers. For mono output, set the MONO bit in the Audio Control Register (ACR) to '1'. For stereo output, set the MONO bit to '0'.
To minimize noise and interference, keep analog and digital signals separate, use separate power planes for analog and digital supplies, and avoid crossing analog and digital signal traces. Additionally, use a solid ground plane and decouple the power supplies properly.
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TAS5709APHPR Overview
Use the download button to access the TAS5709APHPR schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
