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TAS5720ATDAPRQ1 - Texas Instruments

Description: TAS5720A-Q1 1x25-W Digital Input Closed-Loop Automotive Class-D Audio Amplifier

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TAS5720ATDAPRQ1 - Texas Instruments - PCB symbol
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TAS5720ATDAPRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DAP0032B-1
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TAS5720ATDAPRQ1 - Texas Instruments - 3D model - Small Outline Packages - DAP0032B-1
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TAS5720ATDAPRQ1 Details

  • Manufacturer Part Number:

    TAS5720ATDAPRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-12-03

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Noise Figure-Nom:

    100 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    25 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP32,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    26.4 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

TAS5720ATDAPRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TAS5720ATDAPRQ1 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. TI provides a recommended PCB layout in the datasheet and application notes.
  • To optimize thermal performance, ensure good airflow around the device, use a heat sink if possible, and avoid blocking the thermal pads on the package. TI provides thermal design guidelines in the datasheet and application notes.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures proper device initialization and prevents latch-up.
  • Start by checking the power supply voltages, clock signal, and digital input signals. Use an oscilloscope to verify the output signal and check for any signs of oscillation or instability. Consult the datasheet and application notes for troubleshooting guidelines.
  • The maximum allowed power dissipation for the TAS5720ATDAPRQ1 is dependent on the operating conditions and package type. Consult the datasheet for the specific power dissipation limits and thermal design guidelines.

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TAS5720ATDAPRQ1 Overview

Use the download button to access the TAS5720ATDAPRQ1 schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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