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TAS6424LQDKQRQ1 - Texas Instruments

Description: Audio Amplifiers 27-W, 2-MHz Digital Input 4-Channel Automotive Class-D Audio Amplifier 56-HSSOP -40 to 125

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TAS6424LQDKQRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DKQ0056A
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TAS6424LQDKQRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DKQ0056A
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TAS6424LQDKQRQ1 Details

  • Manufacturer Part Number:

    TAS6424LQDKQRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e4

  • Length:

    18.415 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    27 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.34 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max (Vsup):

    3.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.49 mm

TAS6424LQDKQRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow the guidelines in the 'TAS6424LQDKQRQ1 PCB Layout Guidelines' application note (SLUAUH5) for optimal performance.
  • To optimize thermal performance, ensure good airflow around the device, use a heat sink if possible, and follow the thermal design guidelines in the datasheet. Additionally, consider using thermal interface materials and thermal vias to improve heat dissipation.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures proper device initialization and prevents potential latch-up conditions.
  • Start by reviewing the datasheet and application notes for common issues and troubleshooting guidelines. Use oscilloscopes and logic analyzers to debug the device's behavior, and consult the Texas Instruments support forums and documentation for additional resources.
  • To ensure EMI and EMC compliance, follow the guidelines in the datasheet and application notes for PCB layout, component selection, and shielding. Additionally, consider using EMI filters, ferrite beads, and other noise-reducing components to minimize electromagnetic interference.

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TAS6424LQDKQRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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