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TB6584AFNG - Toshiba

Description: 3-Phase Full-Wave Sine-Wave PWM Brushless Motor Controller

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Symbol
TB6584AFNG - Toshiba - PCB symbol
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PCB Footprints
TB6584AFNG - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - SSOP30-P-300-0.65_2024
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3D Models
TB6584AFNG - Toshiba - 3D model - Small Outline Packages - SSOP30-P-300-0.65_2024
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TB6584AFNG Details

  • Manufacturer Part Number:

    TB6584AFNG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-30

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Analog IC - Other Type:

    3-PHASE BRUSHLESS DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G30

  • Length:

    9.7 mm

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    115 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current-Max:

    0.002 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP30,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.6 mm

TB6584AFNG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a thermal via array under the IC to dissipate heat efficiently.
  • Implement a heat sink with a thermal interface material, ensure good airflow, and consider using a thermal sensor to monitor the device temperature. Also, follow the recommended operating conditions and derating guidelines.
  • The TB6584AFNG has built-in ESD protection diodes, but additional external protection may be necessary depending on the application. Follow proper PCB design and handling practices to prevent latch-up and ESD damage.
  • Yes, the TB6584AFNG is suitable for high-reliability and automotive applications. However, ensure compliance with relevant industry standards (e.g., AEC-Q100) and perform thorough testing and validation for your specific use case.
  • Follow the recommended soldering profile: peak temperature 240°C, time above 217°C 60-90 seconds. For rework, use a low-temperature soldering iron and a thermal protection device to prevent overheating.

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TB6584AFNG Overview

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