Please enter a minimum 3 letters or numbers
Technical Content
Part Image

TB6865AFG - Toshiba

Description: Wireless Charging ICs High-Current Output Power Transmitter IC

Download TB6865AFG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
TB6865AFG - Toshiba - PCB symbol
click to zoom
PCB Footprints
TB6865AFG - Toshiba PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP100-P-1414-0.50G
click to zoom
3D Models
TB6865AFG - Toshiba - 3D model - Quad Flat Packages - LQFP100-P-1414-0.50G
click to zoom

TB6865AFG Details

  • Manufacturer Part Number:

    TB6865AFG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active Unconfirmed

  • Package Description:

    14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    2

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    14 mm

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

TB6865AFG Frequently Asked Questions (FAQs)

  • Toshiba recommends a 4-layer PCB with a thermal relief pattern on the bottom layer to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • Toshiba recommends using a heat sink with a thermal resistance of 10°C/W or less, and ensuring good airflow around the device. Additionally, derating the output current and voltage can help reduce thermal stress.
  • Toshiba recommends limiting the voltage on the VCC pin to 7V or less during power-up and power-down sequences to prevent damage to the internal voltage regulator.
  • Check the OCP threshold setting, ensure proper PCB layout and routing, and verify that the output current is within the specified range. Also, check for any external components that may be causing the OCP to trigger unnecessarily.
  • Yes, the TB6865AFG is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards and regulations.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TB6865AFG Overview

Use the download button to access the TB6865AFG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TB686, or try a keyword search, such as Other Telecom ICs

Parts related to TB6865AFG

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑