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TC54VC2702EMB713 - Microchip

Description: Microchip TC54VC2702EMB713, Voltage Detector 2.75V max., 3-Pin SOT-89

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TC54VC2702EMB713 - Microchip - PCB symbol
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PCB Footprints
TC54VC2702EMB713 - Microchip PCB footprint - Other - Other - TC54VC2702EMB713-4
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TC54VC2702EMB713 - Microchip - 3D model - Other - TC54VC2702EMB713-4
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TC54VC2702EMB713 Details

  • Manufacturer Part Number:

    TC54VC2702EMB713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, SOT-89, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-89-3

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Length:

    4.495 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOF

  • Package Equivalence Code:

    TO-243

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max (Isup):

    0.004 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    0.7 V

  • Supply Voltage-Nom (Vsup):

    2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    1.5 mm

  • Terminal Position:

    SINGLE

  • Threshold Voltage-Nom:

    +2.7V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2.445 mm

TC54VC2702EMB713 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can also help to dissipate heat efficiently.
  • To ensure reliable operation over the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and connected. Additionally, consider using a thermally conductive adhesive or thermal tape to improve heat transfer.
  • For EMI and RFI shielding, consider using a metal shield or a conductive enclosure to enclose the device and associated circuitry. Ensure that the shield is properly grounded and that there are no gaps or openings that could compromise shielding effectiveness. Additionally, use EMI-absorbing materials and follow good PCB design practices to minimize radiation.
  • To handle power sequencing and voltage ramp-up/ramp-down, ensure that the power supply voltage is stable and well-regulated. Use a soft-start circuit or a voltage supervisor to control the power-up sequence and prevent voltage overshoot or undershoot. Also, consider using a power-on reset circuit to ensure that the device is properly reset during power-up.
  • To prevent damage and ensure reliability, store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or leads. Use anti-static wrist straps or mats when handling the device, and avoid bending or flexing the leads.

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TC54VC2702EMB713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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