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TC850CPL - Microchip

Description: Microchip TC850CPL, 15-bit +Sign Parallel ADC, Differential Input, 40-Pin PDIP

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TC850CPL - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 40-Pin PDIP (Wide
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TC850CPL - Microchip  - 3D model - Dual-In-Line Packages - 40-Pin PDIP (Wide
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TC850CPL Details

  • Manufacturer Part Number:

    TC850CPL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    PDIP-40

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog Input Voltage-Max:

    3.5 V

  • Analog Input Voltage-Min:

    3.2 V

  • Converter Type:

    ADC, MULTI-SLOPE

  • JESD-30 Code:

    R-PDIP-T40

  • JESD-609 Code:

    e3

  • Length:

    51.97 mm

  • Linearity Error-Max (EL):

    0.0061%

  • Negative Supply Voltage-Nom:

    -5 V

  • Number of Analog In Channels:

    1

  • Number of Bits:

    15

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    PARALLEL, 8 BITS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP40,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

TC850CPL Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a heat sink or thermal interface material, ensure good airflow, and consider derating the device's power dissipation according to the datasheet's thermal derating curve.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF to 10 μF is recommended, depending on the specific application and input voltage ripple requirements.
  • Check the PCB layout for noise coupling, ensure proper decoupling, and verify the input and output capacitor values. Also, check for voltage regulator module (VRM) stability and ensure the output voltage is within the recommended range.
  • The maximum allowed voltage drop is 0.5 V for the input (VIN to GND) and 0.3 V for the output (VOUT to GND). Exceeding these limits may affect the device's performance and reliability.

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TC850CPL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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