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TCK111G,LF - Toshiba

Description: Power Switch ICs - Power Distribution 3A ANALOG IC LOAD

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Symbol
TCK111G,LF - Toshiba - PCB symbol
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PCB Footprints
TCK111G,LF - Toshiba PCB footprint - BGA - BGA - NJU7223F50
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3D Models
TCK111G,LF - Toshiba - 3D model - BGA - NJU7223F50
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TCK111G,LF Details

  • Manufacturer Part Number:

    TCK111G,LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WCSP-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B6

  • Length:

    1.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.54 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.1 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1 mm

TCK111G,LF Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for TCK111G,LF is -40°C to 125°C.
  • To ensure reliability, it is recommended to derate the power dissipation of the device according to the temperature derating curve provided in the datasheet, and to ensure good thermal design and heat sinking.
  • The maximum allowable voltage for the TCK111G,LF is 1.5 times the rated voltage, but not exceeding 120% of the rated voltage for a maximum of 10 seconds.
  • The TCK111G,LF should be stored in a dry, cool place, away from direct sunlight and moisture. During shipping, the devices should be protected from mechanical stress, moisture, and electrostatic discharge.
  • When soldering the TCK111G,LF, the soldering iron temperature should not exceed 260°C, and the soldering time should not exceed 3 seconds. The device should also be protected from excessive soldering heat and mechanical stress.

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TCK111G,LF Overview

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