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TCK127BG,LF - Toshiba

Description: Power Switch ICs - Power Distribution Load Switch IC, V=1.0V-5.5V, Iout(A): 1, Iq(nA)=0.08, Pd(W)=1,Active-High WCSP4G

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Symbol
TCK127BG,LF - Toshiba - PCB symbol
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PCB Footprints
TCK127BG,LF - Toshiba PCB footprint - Other - Other - WCSP4E-_2020
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3D Models
TCK127BG,LF - Toshiba - 3D model - Other - WCSP4E-_2020
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TCK127BG,LF Details

  • Manufacturer Part Number:

    TCK127BG,LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WCSP-4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-XBGA-B4

  • Length:

    0.645 mm

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.465 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Width:

    0.645 mm

TCK127BG,LF Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • To ensure SOA, monitor the device's voltage, current, and temperature. Use a thermal management system, and avoid exceeding the maximum ratings specified in the datasheet.
  • Toshiba recommends a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max) to prevent damage to the device.
  • Yes, the TCK127BG,LF is qualified for automotive and high-reliability applications, but additional testing and validation may be required to meet specific industry standards.
  • Store the device in a dry environment, and follow the recommended moisture sensitivity level (MSL) handling procedures to prevent damage during assembly and reflow soldering.

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TCK127BG,LF Overview

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