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TCK22974G,LF - Toshiba

Description: Power Switch ICs - Power Distribution Load Switch 2.0A 1.1V to 5.5V

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PCB Footprints
TCK22974G,LF - Toshiba PCB footprint - BGA - BGA - bga-6
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3D Models
TCK22974G,LF - Toshiba  - 3D model - BGA - bga-6
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TCK22974G,LF Details

  • Manufacturer Part Number:

    TCK22974G,LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WCSP-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B6

  • Length:

    1.2 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.59 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.1 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    0.8 mm

TCK22974G,LF Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Implement a heat sink or thermal management system, and ensure the device is operated within the recommended temperature range (TJ = -40°C to 150°C).
  • The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause damage to the device.
  • Yes, the TCK22974G,LF is suitable for high-frequency switching applications up to 100 kHz, but ensure proper PCB layout and decoupling to minimize EMI and noise.
  • Implement ESD protection measures such as TVS diodes, ESD filters, or ESD-resistant components to prevent damage from electrostatic discharge.

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