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TCM809JVNB713 - Microchip

Description: IC RESET MONITOR 4.00V

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TCM809JVNB713 - Microchip PCB footprint - Other - Other - SOT95P237X112-3N
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TCM809JVNB713 - Microchip  - 3D model - Other - SOT95P237X112-3N
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TCM809JVNB713 Details

  • Manufacturer Part Number:

    TCM809JVNB713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    LEAD FREE, PLASTIC, TO-236, SOT-23B, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.03 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4V

  • Width:

    1.3 mm

TCM809JVNB713 Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature ranges. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a stable temperature.
  • In high-reliability applications, it's crucial to follow Microchip's guidelines for design, manufacturing, and testing. This includes adhering to strict quality control measures, using qualified components, and performing thorough testing and validation.
  • To troubleshoot oscillator-related issues, check the oscillator circuitry for proper component values, ensure the crystal is properly connected, and verify the oscillator enable pin is correctly configured. If issues persist, consult Microchip's application notes and technical support resources.
  • For radiation-hardened or high-temperature applications, consult Microchip's radiation-hardened and high-reliability product offerings. Additionally, consider using specialized packaging, such as ceramic or hermetic packages, and follow strict design and testing guidelines to ensure reliable operation.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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