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TCM810MVLB713 - Microchip

Description: Microchip TCM810MVLB713, Voltage Supervisor 4.5V max., 3-Pin SC-70

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TCM810MVLB713 - Microchip PCB footprint - Other - Other - SOT65P130X110-3N
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TCM810MVLB713 Details

  • Manufacturer Part Number:

    TCM810MVLB713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SC-70, 3-PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SC70-3

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.03 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.38V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.25 mm

TCM810MVLB713 Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane on the bottom layer, and thermal vias under the device to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation, follow the recommended operating conditions, including voltage, current, and temperature ranges. Also, ensure proper thermal management, and consider using thermal monitoring and shutdown features to prevent overheating.
  • The internal voltage regulator has a limited current capability (typically 50-100 mA) and may not be suitable for powering external components. It's recommended to use an external voltage regulator for higher current requirements.
  • Power sequencing can be implemented using the device's power-good output, reset input, and enable input. The power-good output can be used to monitor the output voltage, and the reset input can be used to reset the device during power-up or power-down sequences.
  • To mitigate EMI and RFI, follow proper PCB layout practices, such as using a solid ground plane, minimizing trace lengths, and using shielding or filtering components. Additionally, consider using the device's built-in EMI reduction features, such as spread spectrum clocking.

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TCM810MVLB713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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