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TCM810ZVLB713 - Microchip

Description: Microchip TCM810ZVLB713, Voltage Supervisor, 2.5 → 5 V, 3-Pin SC-70

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TCM810ZVLB713 - Microchip PCB footprint - Other - Other - SOT65P180X110-3N
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TCM810ZVLB713 Details

  • Manufacturer Part Number:

    TCM810ZVLB713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SC-70, 3-PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SC70-3

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.025 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP3/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.025 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.32V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.25 mm

TCM810ZVLB713 Frequently Asked Questions (FAQs)

  • Microchip recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, keeping the thermal vias as close as possible to the device and using a thermal pad on the bottom of the device can help to dissipate heat more efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection mechanisms if necessary.
  • The internal oscillator of the TCM810ZVLB713 has a limited frequency range and accuracy. If your application requires a higher frequency or tighter frequency tolerance, it's recommended to use an external clock source. Additionally, if you need to synchronize multiple devices or ensure precise timing, an external clock source is a better option.
  • Power sequencing and voltage monitoring can be implemented using external components such as voltage supervisors, power sequencers, and voltage monitors. These components can be connected to the device's power pins to ensure proper power-up and power-down sequencing, as well as monitoring of voltage levels to prevent damage or malfunction.
  • To ensure EMI and ESD protection, follow best practices such as using a ground plane, decoupling capacitors, and EMI filters. Additionally, consider using ESD protection devices, such as TVS diodes, and following proper PCB layout and routing guidelines to minimize EMI radiation and susceptibility.

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TCM810ZVLB713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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