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TDA1308T/N2,112 - NXP

Description: Class-AB stereo headphone driver

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TDA1308T/N2,112 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO8
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TDA1308T/N2,112 - NXP  - 3D model - Small Outline Packages - SO8
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TDA1308T/N2,112 Details

  • Manufacturer Part Number:

    TDA1308T/N2,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.3%

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    0.04 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max (Vsup):

    3.5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TDA1308T/N2,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA1308T involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. A minimum of 10uF decoupling capacitor is recommended.
  • The maximum power dissipation of the TDA1308T is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature.
  • The TDA1308T is rated for operation up to 85°C ambient temperature. However, the device's performance and reliability may degrade at higher temperatures. It's recommended to derate the power dissipation and ensure proper heat sinking for high-temperature applications.
  • To troubleshoot issues with the TDA1308T, start by verifying the power supply voltage and ensuring that it's within the recommended range. Check for proper decoupling and bypassing, and verify that the input and output signals are within the recommended specifications. Use an oscilloscope to check for oscillations or other anomalies.

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TDA1308T/N2,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image TDA1308T NXP Semiconductors

CLASS AB AUDIO AMPLIFIER, 0.04W, 2 Channel(s), 1 Func, CMOS, PDSO8