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TDA1308T/N2 - NXP

Description: 5v

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TDA1308T/N2 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT96-1
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TDA1308T/N2 - NXP  - 3D model - Small Outline Packages - SOT96-1
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TDA1308T/N2 Details

  • Manufacturer Part Number:

    TDA1308T/N2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    5 mA

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

TDA1308T/N2 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the TDA1308T/N2 can be found in the NXP application note AN10911, which provides guidelines for PCB design, component placement, and thermal management to ensure optimal performance and reliability.
  • The selection of external components such as resistors, capacitors, and inductors depends on the specific application and operating conditions. NXP provides a component selection guide in the datasheet, and additional guidance can be found in the application note AN10911.
  • The TDA1308T/N2 has an operating temperature range of -40°C to +125°C, but the maximum junction temperature (Tj) should not exceed 150°C. It's essential to ensure proper thermal management to prevent overheating and ensure reliable operation.
  • Common issues with the TDA1308T/N2 can often be resolved by checking the PCB layout, component values, and soldering quality. NXP provides a troubleshooting guide in the application note AN10911, which covers common issues and their solutions.
  • Yes, the TDA1308T/N2 is compatible with lead-free soldering processes. NXP ensures that their products meet the requirements of the RoHS (Restriction of Hazardous Substances) directive, and the TDA1308T/N2 can be soldered using lead-free soldering techniques.

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TDA1308T/N2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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